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Short Range Ultrasonic Magnetic Communication
Our technology is an affordable alternative solution to Bluetooth and NFC with additional benefits. It is a short-range (0-15 cm) communication solution that will work with any mobile devices with a loudspeaker (e.g. smartphones, tablets or application-specific devices) without the need for pairing. No further hardware is needed on the transmitter -
Industrial Grade Mission-Critical Wireless Solutions for Factory Automation
Factories require flexible and adaptable machines, mobile equipment and intelligent devices requiring industrial-grade, robust, fast, secure and scalable wireless communication. Our technology presents reliability that is literally a million times better than any other wireless protocol, 100 times faster, deterministic and capable of supporting 100 -
Innovative Food Preservation Solution
The company has designed systems with energy saving technology to better manage storage of perishable products in a refrigerator, with the aim to preserve the quality of the food, reduce wastage from rotting. In addition, with their patented ionic technology, the solution improves the performance of food ripening process and provides quick & high-q -
Novel Platform Metallization Technology that Enables Metal Electrode Production
Metallization is an integral part of a modern electronic device. Every electronic device has metal electrodes in it. Foldable devices, OLED, sensors, solar cells, touchscreens, wearables and energy storage need new materials and technologies for making flexible metal electrodes. This new metallization technology is suitable for functional metallic -
Mobile terminal and control method thereof
(Thiết bị đầu cuối di động và phương pháp điều khiển) The present invention relates to a mobile terminal which can receive user requests by user motions and a control method thereof. The mobile terminal can comprise: a communications unit for forming a communication channel with a user motion recognition sensor, and receiving user motion informatio -
Through Substrate Via (TSV) with Embedded Capacitor for 3D Packaging
The demand for on-chip capacitor goes increasingly higher for integrated circuits (ICs) with 3D packaging technologies, because more capacitance-hungry chips are being stacked within a single IC package. However, huge surface area is required to implement those on-chip capacitors. To address this issue, a novel method of embedding capacitors into t