Technology Features & Specifications
This technology can be implemented whereas TSVs are involved in IC packagings, e.g., 2.5D interposer, 3D Si substrate and fan-out molding. It brings in 10× higher capacitance density compared with that of conventional trench capacitor with the same design parameters. No degradation of leakage current and breakdown voltage need to be comprised.
On-chips capacitors can be used for a wide range of circuit applications:
- De-coupling capacitors for power distribution network
- Integrated voltage regulators
- Analog to digital converter
- Radio-frequency circuits
- Temporary energy storage
Market Trends and Opportunities
The semiconductor industry is faced with a new trend of integrating more versatile devices, called “More than Moore” (MtM). It is certain that the demand for on-chip capacitors will increase explosively. At the same time, this MtM trend makes TSV a key enabler to interconnect chips vertically. The cost of TSV process keeps decreasing, as the it becomes more mature. The mass production of high bandwidth memory, involving thousands of TSVs, takes off in 2018. More design houses and foundries will be willing to adopt TSV in their products. This makes a great opportunity to use this invention to implement on-chip capacitors with superb capacitance density.
On-chip capacitors with small footprint will not only reduce the current manufacturing cost due to its reduced surface area, but also enable the potential integration of many other capacitance-hungry chips in 3D packagings.