Technology Features & Specifications
The method is primarily a wet pre-treatment of the work piece. It is most suitable for electroless plating of plastic and ceramic substrate. Electroless plating of Nickel (Ni) on polyimide and ABS substrate has been demonstrated. In the case of ABS, a reduction of Pd loading from 160ppm to 3.2ppm has been achieved while maintaining the high catalytic activity. The plated surface also possesses sufficient adhesion and abrasion resistence on polyimide and ABS subtrates.
Electroless plating has been widely used in various industries for surface coating of automobile body parts, ornamental, jewelleries and ceramic metalization of electronics.
Market Trends and Opportunities
The growing popularity of electroless plating is challenging the growth of the more established electroplating technology. The global world market for electroplating was around $13.64 billion in 2015 (according to GIA report). Ceramic metalization in the production of electronic circuits is another market for electroless plating.
Ease of implementation on existing electroless plating line. With the wet pre-treatment method, the Pd loading can be significantly reduced for the metalization of non-conductive substrates of various geometry.